PK554 (v1.1) october 26, 2012 www.xilinx.com 1 pk 554 (v1.1 ) october 26 , 20 1 2 100% material declaration data sheet for 7 series ff g1761 average weight: 20.7610 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total (%) silicon die 0.828955 3.993 silicon (si) 7440- 21- 3 100.00 basis 0.828955 solder bump 0.038857 0.187 tin (sn) 7440- 31- 5 63.00 basis 0.024480 lead (pb) 7439- 92- 1 37.00 basis 0.014377 solder paste 0.014700 0.071 tin (sn) 7440- 31- 5 96.50 basis 0.014186 silver (ag) 7440- 22- 4 3.00 basis 0.000441 copper (cu) 7440- 50- 8 0.50 basis 0.000074 capacitor 1 0.041280 0.199 batio3 type 12047- 27- 7 61.80 ceramic 0.025511 inner electrode(ni) 7440- 02- 0 27.00 inner electrode 0.011146 outer electrode(cu) 7440- 50- 8 9.90 outer electrode 0.004087 plating1(ni) 7440- 02- 0 0.40 plating1 0.000165 plating2(sn) 7440- 31- 5 0.90 plating2 0.000372 capacitor 2 0.022800 0.110 batio3 type 12047- 27- 7 61.70 ceramic 0.014068 inner electrode(ni) 7440- 02- 0 4.89 inner electrode 0.001115 indium tin oxide 50926- 11- 9 18.30 outer electrode 0.004172 outer electrode(cu) 7440- 50- 8 13.40 outer electrode 0.003055 plating1(ni) 7440- 02- 0 0.49 plating1 0.000112 plating2(sn) 7440- 31- 5 1.22 plating2 0.000278 capacitor 3 0.005400 0.026 batio3 type 12047- 27- 7 66.00 ceramic 0.003564 inner electrode(ni) 7440- 02- 0 2.67 inner electrode 0.000144 outer electrode(cu) 7440- 50- 8 23.33 outer electrode 0.001260 plating1(ni) 7440- 02- 0 2.33 plating1 0.000126 plating2(sn) 7440- 31- 5 5.67 plating2 0.000306 ? copyright 201 2 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet ? 7 series ffg1761 PK554 (v1.1) october 26, 2012 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total capacitor 4 0.015810 0.076 batio3 type 12047- 27- 7 51.10 ceramic 0.008079 inner electrode(ni) 7440- 02- 0 27.00 inner electrode 0.004269 outer electrode(cu) 7440- 50- 8 16.00 outer electrode 0.002530 glass 65997- 17- 3 0.90 0.000142 plating1(ni) 7440- 02- 0 2.00 plating1 0.000316 plating2(sn) 7440- 31- 5 3.00 plating2 0.000474 underfill 0.082000 0.395 bisphenol f/ epichlorohydrin copolymer 9003- 36- 5 20.00 basis 0.016400 phenolic resin trade secret 15.00 basis 0.012300 bisphenol a type liquid epoxy resin 25068- 38- 6 5.00 basis 0.004100 amine type accelerator trade secret 5.00 basis 0.004100 silicon dioxide 60676- 86- 0 51.50 basis 0.042230 carbon black 1333- 86- 4 1.00 basis 0.000820 additives trade secret 2.50 additive 0.002050 lid 9.724000 46.838 copper (cu) 7440- 50- 8 99.12 main material 9.641346 nickel (ni) 7440- 02- 0 0.88 main material 0.082654 lid adhesive 0.340000 1.638 aluminum oxide ai203 1344- 28- 1 70.00 basis 0.238000 dimethyl siloxane, dimethylvinyl - terminated 68083- 19- 2 30.00 basis 0.102000 solder ball 1.470244 7.082 tin (sn) 7440- 31- 5 96.50 main material 1.418785 silver (ag) 7440- 22- 4 3.00 main material 0.044107 copper (cu) 7440- 50- 8 0.50 main material 0.007351 substrate 8.176955 39.386 copper (cu) 7440- 50- 8 48.07 main material 3.930662 tin (sn) 7439- 92- 1 0.08 main material 0.006542 lead (pb) 7440- 31- 5 0.11 main material 0.008995 silver (ag) 7440- 22- 4 0.50 main material 0.040885 bt core 7440- 31- 5 39.82 main material 3.256063 abf 7440- 50- 8 10.41 main material 0.851221 solder mask n/a 1.01 main material 0.082587
100% material declaration data sheet ? 7 series ffg1761 PK554 (v1.1) october 26, 2012 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (?contractors?). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accur acy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 03/23/12 1.0 initial xilinx release. 10/26/12 1.1 update substrate component
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